Effect of heating on the electrical resistivity of conductive adhesive and soldered joints

Verfasser / Beitragende:
[Kyu Kim, D. Chung]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/9(2002-09-01), 933-939
Format:
Artikel (online)
ID: 471147397