Mechanical and tribological properties of interlayer films for the damascene-Cu chemical-mechanical planarization process

Verfasser / Beitragende:
[A. Sikder, Ashok Kumar]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/10(2002-10-01), 1016-1021
Format:
Artikel (online)
ID: 471147982