Mechanism of electromigration failure in submicron Cu interconnects

Verfasser / Beitragende:
[Nancy Michael, Choong-Un Kim, Qing-Tang Jiang, R. Augur, P. Gillespie]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/10(2002-10-01), 1004-1008
Format:
Artikel (online)
ID: 471147990