Interfacial reaction of Pb-Sn solder and Sn-Ag solder with electroless Ni deposit during reflow

Verfasser / Beitragende:
[M. Alam, Y. Chan, K. Hung]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/10(2002-10-01), 1117-1121
Format:
Artikel (online)
ID: 471148016