Effect of copper seed aging on electroplating-induced defects in copper interconnects

Verfasser / Beitragende:
[Daniele Contestable-Gilkes, Deepak Ramappa, Minseok Oh, Sailesh Merchant]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/10(2002-10-01), 1047-1051
Format:
Artikel (online)
ID: 471148083