A model for wafer scale variation of material removal rate in chemical mechanical polishing based on viscoelastic pad deformation
Gespeichert in:
Verfasser / Beitragende:
[Guanghui Fu, Abhijit Chandra]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/10(2002-10-01), 1066-1073
Format:
Artikel (online)
Online Zugang: