Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints

Verfasser / Beitragende:
[Z. Chen, Y. Shi, Z. Xia, Y. Yan]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/10(2002-10-01), 1122-1128
Format:
Artikel (online)
ID: 471148210