Effect of burn-in on shear strength of 63Sn-37Pb solder joints on an Au/Ni/Cu substrate

Verfasser / Beitragende:
[Michael Marks]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/4(2002-04-01), 265-271
Format:
Artikel (online)
ID: 471148245