Microstructural characterization of damage in thermomechanically fatigued Sn-Ag based solder joints

Verfasser / Beitragende:
[S. Choi, J. Lee, K. Subramanian, J. Lucas, T. Bieler]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/4(2002-04-01), 292-297
Format:
Artikel (online)
ID: 471148369