Evolution of residual-inplane stress during adhesive curing and recuring in chip-on-board packages

Verfasser / Beitragende:
[Zhiguo Sun, Weidong Huang, Yuqi Jiang, Le Luo]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/8(2002-08-01), 887-894
Format:
Artikel (online)
ID: 471148385