The influence of thermal aging on joint strength and fracture surface of Pb/Sn and Au/Sn solders in laser diode packages

Verfasser / Beitragende:
[M. Sheen, C. Chang, H. Teng, J. Kuang, K. Hsieh, W. Cheng]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/8(2002-08-01), 895-902
Format:
Artikel (online)
ID: 47114844X