Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates
Gespeichert in:
Verfasser / Beitragende:
[M. Chiu, S. Wang, T. Chuang]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/5(2002-05-01), 494-499
Format:
Artikel (online)
Online Zugang: