Intermetallic compounds formed at the interface between liquid indium and copper substrates

Verfasser / Beitragende:
[C. Yu, S. Wang, T. Chuang]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/5(2002-05-01), 488-493
Format:
Artikel (online)
ID: 471148792