Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliability

Verfasser / Beitragende:
[Young-Doo Jeon, Kyung-Wook Paik, Kyung-Soon Bok, Woo-Suk Choi, Chul-Lae Cho]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/5(2002-05-01), 520-528
Format:
Artikel (online)
ID: 471148814