Joint shape, microstructure, and shear strength of lead-free solder joints with different component terminations

Verfasser / Beitragende:
[Shawkret Ahat, Huang Weidong, Sheng Mei, Luo Le]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/2(2002-02-01), 136-141
Format:
Artikel (online)
ID: 471148946