Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying

Verfasser / Beitragende:
[I. Anderson, B. Cook, J. Harringa, R. Terpstra]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/11(2002-11-01), 1166-1174
Format:
Artikel (online)
ID: 471148954