Damage accumulation under repeated reverse stressing of Sn-Ag solder joints

Verfasser / Beitragende:
[K. Chen, A. Telang, J. Lee, K. Subramanian]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/11(2002-11-01), 1181-1189
Format:
Artikel (online)
ID: 471149039