Effect of heat treatment on the electrical resistivity of near-eutectic Sn-Ag-Cu Pb-Free solder alloys

Verfasser / Beitragende:
[B. Cook, I. Anderson, J. Harringa, R. Terpstra]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/11(2002-11-01), 1190-1194
Format:
Artikel (online)
ID: 471149144