Phenomena of electroless Ni-P and intermetallic-compound stripping and dissolving in Sn-Bi and Sn-Pb solder joints with Au/EN/Cu metallization

Verfasser / Beitragende:
[Chien-Sheng Huang, Jih-Hung Yeh, Bi-Lian Young, Jenq-Gong Duh]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/11(2002-11-01), 1230-1237
Format:
Artikel (online)
ID: 471149152