A study of the effects of solder volume on the interfacial reactions in solder joints using the differential scanning calorimetry technique

Verfasser / Beitragende:
[W. Choi, S. Kang, D. Shih]
Ort, Verlag, Jahr:
2002
Enthalten in:
Journal of Electronic Materials, 31/11(2002-11-01), 1283-1291
Format:
Artikel (online)
ID: 471149179