Heat transfer between wafer and electrode in a high density plasma etcher

Verfasser / Beitragende:
[Yeon Im, Yoon-Bong Hahn]
Ort, Verlag, Jahr:
2002
Enthalten in:
Korean Journal of Chemical Engineering, 19/2(2002-03-01), 347-350
Format:
Artikel (online)
ID: 471153451