caa a22 4500 475791835 CHVBK 20180406123713.0 cr unu---uuuuu 170329e20001101xx s 000 0 eng 10.1007/s005420000053 doi (NATIONALLICENCE)springer-10.1007/s005420000053 Development toward an all-silicon integrated thermal management system: the integrated MCM [Elektronische Daten] [J. Pilchowski, A. D. Hölke, H. T. Henderson, M. Kazmierczak, F. M. Gerner] A new all-silicon multichip module with integrated thermal management system is presented. Our new packaging approach combines the benefits of wafer-scale integration with the flexibility of independently fabricated and pre-tested devices, allowing the development of highly integrated systems. Wet anisotropic etching is used for the dicing of silicon integrated circuits as well as for the fabrication of the chip-receiving cavities in the silicon substrate. The etching exposes {1 1 1} type planes in both chip and receiving surface, assuring a virtually perfect mating of the assemblage. The system is complemented with an integrated silicon heat sink, which can maintain heat fluxes in excess of 100 W/cm2. Springer-Verlag Berlin Heidelberg, 2000 Pilchowski J. Center for Microelectronic Sensors and MEMS, University of Cincinnati, P.O. Box 210030, Cincinnati, OH 45221-0030, USA, US aut Hölke A. D. Center for Microelectronic Sensors and MEMS, University of Cincinnati, P.O. Box 210030, Cincinnati, OH 45221-0030, USA, US aut Henderson H. T. Center for Microelectronic Sensors and MEMS, University of Cincinnati, P.O. Box 210030, Cincinnati, OH 45221-0030, USA, US aut Kazmierczak M. Center for Microelectronic Sensors and MEMS, University of Cincinnati, P.O. Box 210030, Cincinnati, OH 45221-0030, USA, US aut Gerner F. M. Center for Microelectronic Sensors and MEMS, University of Cincinnati, P.O. Box 210030, Cincinnati, OH 45221-0030, USA, US aut https://doi.org/10.1007/s005420000053 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s005420000053 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Pilchowski J. Center for Microelectronic Sensors and MEMS, University of Cincinnati, P.O. Box 210030, Cincinnati, OH 45221-0030, USA, US aut NATIONALLICENCE 700 1- Hölke A. D. Center for Microelectronic Sensors and MEMS, University of Cincinnati, P.O. Box 210030, Cincinnati, OH 45221-0030, USA, US aut NATIONALLICENCE 700 1- Henderson H. T. Center for Microelectronic Sensors and MEMS, University of Cincinnati, P.O. Box 210030, Cincinnati, OH 45221-0030, USA, US aut NATIONALLICENCE 700 1- Kazmierczak M. Center for Microelectronic Sensors and MEMS, University of Cincinnati, P.O. Box 210030, Cincinnati, OH 45221-0030, USA, US aut NATIONALLICENCE 700 1- Gerner F. M. Center for Microelectronic Sensors and MEMS, University of Cincinnati, P.O. Box 210030, Cincinnati, OH 45221-0030, USA, US aut Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer