caa a22 4500 475798228 CHVBK 20180406123730.0 cr unu---uuuuu 170329e20000701xx s 000 0 eng 10.1007/s001700070038 doi (NATIONALLICENCE)springer-10.1007/s001700070038 Wetting Analysis of Leadless Chips in Surface Mount Technology [Elektronische Daten] [I. K. Hui, W. L. R. Ipyn] It has been found that in wave soldering, when a chip entered the solder bath with its longitudinal axis parallel to the soldering direction, the resulting shape of the wetted surface of the incoming joint was concave, and the outgoing joint was convex. The difference in wetting of these two joints was analysed from the capillary viewpoints. Solder pads of various lengths were used to control the wetting conditions in infrared reflow soldering. The results show that the amount of tombstoning and joint opening are closely related to the pad length. The relationship between tombstoning, or open joint, and wetting was analysed based on theory, and it was found that the surface tension and the contact angle of the molten solder are the significant factors in the formation of the tombstoning or open joint defect.: Springer-Verlag London Limited, 2000 Keywords: Reflow process nationallicence Surface mount technology nationallicence Wave soldering nationallicence Wetting problems nationallicence Hui I. K. Department of Manufacturing Engineering and Engineering Management, City University of Hong Kong, Kowloon, Hong Kong, HK aut Ipyn W. L. R. Department of Manufacturing Engineering and Engineering Management, City University of Hong Kong, Kowloon, Hong Kong, HK aut https://doi.org/10.1007/s001700070038 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s001700070038 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Hui I. K. Department of Manufacturing Engineering and Engineering Management, City University of Hong Kong, Kowloon, Hong Kong, HK aut NATIONALLICENCE 700 1- Ipyn W. L. R. Department of Manufacturing Engineering and Engineering Management, City University of Hong Kong, Kowloon, Hong Kong, HK aut Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer