caa a22 4500 475814770 CHVBK 20180406123807.0 cr unu---uuuuu 170329e20000101xx s 000 0 eng 10.1023/A:1003847219784 doi (NATIONALLICENCE)springer-10.1023/A:1003847219784 Copper deposition on micropatterned electrodes from an industrial acid copper plating bath [Elektronische Daten] [S. Goldbach, B. Van den Bossche, T. Daenen, J. Deconinck, F. Lapicque] Copper was deposited on micropatterned electrodes in a parallel plate reactor (PPR) using an industrial acid copper plating bath, and the deposit thickness distributions were measured. The plating bath contained, besides copper sulfate and sulfuric acid as main components, small amounts of sodium chloride and an organic additive LP-1TM. Copper deposition was carried out under various flow conditions (laminar and turbulent) and applied current densities. Three patterns, each of them consisting of a series of parallel copper microtracks, were manufactured on the electrode surface. The pattern position was chosen to be parallel or perpendicular to the flow direction, corresponding to the two extreme positions for the industrial plating process of patterned electrodes, in casu the round pattern tracks of minicoils. A multi-ion model was used to simulate copper deposition from sulphuric acid solutions, taking into account flow phenomena controlling the mass transfer rate, and the deposition kinetics. The differential equations were solved numerically by use of the multidimensional upwinding method (MDUM). Copper deposition on plane electrodes was investigated and compared to cd distributions obtained from MDUM-simulations. For the case of perpendicular pattern position in laminar flow, the deposit growth in the vias was also modelled and simulated numerically. Kluwer Academic Publishers, 2000 copper deposition nationallicence current distributions nationallicence microvias nationallicence patterned electrodes nationallicence simulation nationallicence Goldbach S. Laboratoire des Sciences du Génie Chimique, CNRS-ENSIC-INPL, BP 451, F-54001, Nancy, France aut Van den Bossche B. VUB-ETEC, Vrije Universiteit Brussel, Pleinlaan 2, B-1050, Brussel, Belgium aut Daenen T. Philips PMF N.V., Glaslaan S17-II-5, NL-5600, Eindhoven, The Netherlands aut Deconinck J. VUB-ETEC, Vrije Universiteit Brussel, Pleinlaan 2, B-1050, Brussel, Belgium aut Lapicque F. Laboratoire des Sciences du Génie Chimique, CNRS-ENSIC-INPL, BP 451, F-54001, Nancy, France aut Journal of Applied Electrochemistry Kluwer Academic Publishers 30/1(2000-01-01), 1-12 0021-891X 30:1<1 2000 30 10800 https://doi.org/10.1023/A:1003847219784 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1023/A:1003847219784 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Goldbach S. Laboratoire des Sciences du Génie Chimique, CNRS-ENSIC-INPL, BP 451, F-54001, Nancy, France aut NATIONALLICENCE 700 1- Van den Bossche B. VUB-ETEC, Vrije Universiteit Brussel, Pleinlaan 2, B-1050, Brussel, Belgium aut NATIONALLICENCE 700 1- Daenen T. Philips PMF N.V., Glaslaan S17-II-5, NL-5600, Eindhoven, The Netherlands aut NATIONALLICENCE 700 1- Deconinck J. VUB-ETEC, Vrije Universiteit Brussel, Pleinlaan 2, B-1050, Brussel, Belgium aut NATIONALLICENCE 700 1- Lapicque F. Laboratoire des Sciences du Génie Chimique, CNRS-ENSIC-INPL, BP 451, F-54001, Nancy, France aut NATIONALLICENCE 773 0- Journal of Applied Electrochemistry Kluwer Academic Publishers 30/1(2000-01-01), 1-12 0021-891X 30:1<1 2000 30 10800 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer