caa a22 4500 47581634X CHVBK 20180406123811.0 cr unu---uuuuu 170329e20000201xx s 000 0 eng 10.1023/A:1003970925918 doi (NATIONALLICENCE)springer-10.1023/A:1003970925918 Effects of chloride, bromide and iodide ions on internal stress in films deposited during high speed nickel electroplating from a nickel sulfamate bath [Elektronische Daten] [Y. Tsuru, M. Nomura, F.R. Foulkes] The effects of chloride, bromide and iodide additions on the internal stress developed in nickel films deposited during high speed electroplating from nickel sulfamate baths operated close to the nickel ion limiting current density were investigated. The variations in internal strain in the films were detected in situ using a resistance wire-type strain gauge placed on the reverse side of the copper substrate. The film resistance on the as-plated electrodes was measured using an electronic current interrupter technique. The effects of chloride, bromide, and iodide additions could be classified into two groups: (a) chloride and bromide ions, and (b) iodide ions. For chloride and bromide additions over the concentration range of 0.1 to 0.5 M, the nickel deposits exhibited a block- and pyramid-like texture with a (200) crystal orientation. The internal tensile stress developed in 20 μm thick nickel films deposited in the presence of these two halides was as low as 140-170 MPa. Conversely, for additions of iodide, at iodide concentrations greater than 0.1 M the deposited nickel exhibited a fine granular texture of disordered crystal orientation. The internal tensile stress developed in 20 μm thick nickel films deposited from these latter baths tended to rise with increasing iodide concentration to values considerably higher than those observed at similar concentrations of NiCl2 or NiBr2. Kluwer Academic Publishers, 2000 halide addition nationallicence high speed electroplating nationallicence internal stress nationallicence nickel films nationallicence nickel sulfamate bath nationallicence Tsuru Y. Department of Materials Science and Engineering, Kyushu Institute of Technology, 1-1, Sensui, Tobata, 804, Kitakyushu, Japan aut Nomura M. Department of Materials Science and Engineering, Kyushu Institute of Technology, 1-1, Sensui, Tobata, 804, Kitakyushu, Japan aut Foulkes F.R. Department of Chemical Engineering and Applied Chemistry, University of Toronto, M5S 3E5, Toronto, Ontario, Canada aut Journal of Applied Electrochemistry Kluwer Academic Publishers 30/2(2000-02-01), 231-238 0021-891X 30:2<231 2000 30 10800 https://doi.org/10.1023/A:1003970925918 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1023/A:1003970925918 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Tsuru Y. Department of Materials Science and Engineering, Kyushu Institute of Technology, 1-1, Sensui, Tobata, 804, Kitakyushu, Japan aut NATIONALLICENCE 700 1- Nomura M. Department of Materials Science and Engineering, Kyushu Institute of Technology, 1-1, Sensui, Tobata, 804, Kitakyushu, Japan aut NATIONALLICENCE 700 1- Foulkes F.R. Department of Chemical Engineering and Applied Chemistry, University of Toronto, M5S 3E5, Toronto, Ontario, Canada aut NATIONALLICENCE 773 0- Journal of Applied Electrochemistry Kluwer Academic Publishers 30/2(2000-02-01), 231-238 0021-891X 30:2<231 2000 30 10800 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer