caa a22 4500 477051464 CHVBK 20180405111340.0 cr unu---uuuuu 170330e19960201xx s 000 0 eng 10.1007/BF00364066 doi (NATIONALLICENCE)springer-10.1007/BF00364066 Bulk copper electrodeposition on gold imaged by in situ STM: morphology and influence of tip potential [Elektronische Daten] [J. Andersen, G. Bech-Nielsen, P. Møller, J. Reeve] Electrochemical measurements were carried out simultaneously with acquisition of in situ STM images of copper electrodeposition at low cathodic overpotentials and subsequent dissolution from the underlying polycrystalline gold surfaces. The morphologies of the copper deposits were examined for correlation with features of the current-voltage diagram. Copper growth is by nucleation and formation of 3D islands. During the initial stages of bulk copper growth the potentials were fixed at selected values and a balance observed between formation of polycrystalline copper nuclei and of copper crystals. After the first cycle of copper deposition and dissolution the morphology of the polycrystalline gold surface had apparently changed into a recrystallized phase of a copper-gold alloy. At a given stage of the cycle the potential of the electrode was found to depend linearly on the tip potential. In a wide range of tip potentials the onset of copper deposition and end of dissolution showed a potential separation of 59 ± 5 mV indicating a single electron process. Chapman & Hall, 1996 Andersen J. Centre of Advanced Electroplating, The Technical University of Denmark, Building no. 425, DK-2800, Lyngby, Denmark aut Bech-Nielsen G. Centre of Advanced Electroplating, The Technical University of Denmark, Building no. 425, DK-2800, Lyngby, Denmark aut Møller P. Centre of Advanced Electroplating, The Technical University of Denmark, Building no. 425, DK-2800, Lyngby, Denmark aut Reeve J. Chemical Laboratory A, The Technical University of Denmark, Building no. 207, DK-2800, Lyngby, Denmark aut Journal of Applied Electrochemistry Kluwer Academic Publishers 26/2(1996-02-01), 161-170 0021-891X 26:2<161 1996 26 10800 https://doi.org/10.1007/BF00364066 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/BF00364066 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Andersen J. Centre of Advanced Electroplating, The Technical University of Denmark, Building no. 425, DK-2800, Lyngby, Denmark aut NATIONALLICENCE 700 1- Bech-Nielsen G. Centre of Advanced Electroplating, The Technical University of Denmark, Building no. 425, DK-2800, Lyngby, Denmark aut NATIONALLICENCE 700 1- Møller P. Centre of Advanced Electroplating, The Technical University of Denmark, Building no. 425, DK-2800, Lyngby, Denmark aut NATIONALLICENCE 700 1- Reeve J. Chemical Laboratory A, The Technical University of Denmark, Building no. 207, DK-2800, Lyngby, Denmark aut NATIONALLICENCE 773 0- Journal of Applied Electrochemistry Kluwer Academic Publishers 26/2(1996-02-01), 161-170 0021-891X 26:2<161 1996 26 10800 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer