naa a22 4500 510800459 CHVBK 20180411083353.0 cr unu---uuuuu 180411e20130101xx s 000 0 eng 10.1007/s11664-012-2263-7 doi (NATIONALLICENCE)springer-10.1007/s11664-012-2263-7 Thermal Parameters, Microstructure, and Mechanical Properties of Directionally Solidified Sn-0.7wt.%Cu Solder Alloys Containing 0ppm to 1000ppm Ni [Elektronische Daten] [Bismarck Silva, Noé Cheung, Amauri Garcia, José Spinelli] Environmental concerns over the toxicity of Pb are resulting in the progressive ban of Pb-based solders as part of electrical and electronic devices. Sn-Cu alloys are becoming interesting Pb-free solder alternatives. In the case of hypoeutectic Sn-Cu alloys (<0.7wt.% Cu), small alloying additions of Ni can prevent the growth of coarse and deleterious Cu6Sn5 particles. Solidification thermal parameters such as the growth rate, cooling rate, and interfacial heat transfer coefficient (h i) determine the morphology and scale of the phases forming the resulting microstructure. In the present study, directional solidification experiments were carried out with Sn-0.7wt.%Cu, Sn-0.7wt.% Cu-0.05wt.%Ni, and Sn-0.7wt.%Cu-0.1wt.%Ni alloys and interrelations of solidification thermal parameters, microstructure, and tensile properties have been established. The highest time-dependent h i profile was found for the Sn-0.7wt.%Cu-0.1wt.%Ni alloy, which is an indication that this alloy has the highest fluidity. Constrained dendritic arrangements were observed for all alloys experimentally examined. This morphology has been associated with high cooling rates and growth rates. Cellular regions, characterized by aligned eutectic colonies, were also observed to occur for cooling rates lower than 0.9K/s and 6.0K/s for the unmodified Sn-0.7wt.%Cu alloy and for both Ni-modified Sn-Cu alloys, respectively. Experimental Hall-Petch-type equations correlating the ultimate tensile strength and elongation with cell/dendritic spacings are proposed. TMS, 2012 Solidification nationallicence microstructure nationallicence thermal parameters nationallicence mechanical properties nationallicence solder alloys nationallicence Silva Bismarck Department of Materials Engineering, Federal University of São Carlos—UFSCar, 13565-905, São Carlos, SP, Brazil aut Cheung Noé Federal Institute of Education, Science and Technology of São Paulo—IFSP, 13872-550, São João da Boa Vista, SP, Brazil aut Garcia Amauri Department of Materials Engineering, University of Campinas—UNICAMP, PO Box 6122, 13083-970, Campinas, SP, Brazil aut Spinelli José Department of Materials Engineering, Federal University of São Carlos—UFSCar, 13565-905, São Carlos, SP, Brazil aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/1(2013-01-01), 179-191 0361-5235 42:1<179 2013 42 11664 https://doi.org/10.1007/s11664-012-2263-7 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-012-2263-7 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Silva Bismarck Department of Materials Engineering, Federal University of São Carlos—UFSCar, 13565-905, São Carlos, SP, Brazil aut NATIONALLICENCE 700 1- Cheung Noé Federal Institute of Education, Science and Technology of São Paulo—IFSP, 13872-550, São João da Boa Vista, SP, Brazil aut NATIONALLICENCE 700 1- Garcia Amauri Department of Materials Engineering, University of Campinas—UNICAMP, PO Box 6122, 13083-970, Campinas, SP, Brazil aut NATIONALLICENCE 700 1- Spinelli José Department of Materials Engineering, Federal University of São Carlos—UFSCar, 13565-905, São Carlos, SP, Brazil aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/1(2013-01-01), 179-191 0361-5235 42:1<179 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer