naa a22 4500 510800483 CHVBK 20180411083353.0 cr unu---uuuuu 180411e20130101xx s 000 0 eng 10.1007/s11664-012-2258-4 doi (NATIONALLICENCE)springer-10.1007/s11664-012-2258-4 Low-Cycle Fatigue Behavior of 95.8Sn-3.5Ag-0.7Cu Solder Joints [Elektronische Daten] [Y. Tang, G.Y. Li, X.Q. Shi] Low-cycle fatigue (LCF) behavior of 95.8Sn-3.5Ag-0.7Cu solder joints was investigated over a range of test temperatures (25°C, 75°C, and 125°C), frequencies (0.001Hz, 0.01Hz, and 0.1Hz), and strain ranges (0.78%, 1.6%, and 3.1%). Effects of temperature and frequency on the LCF life were studied. Results show that the LCF lifetime decreases with an increase in test temperature or a decrease of test frequency, which is attributed to the longer exposure time to creep and the stress relaxation mechanism during fatigue testing. A modified Coffin-Manson model considering effects of temperature and frequency on the LCF life is proposed. The fatigue exponent and ductility coefficient were found to be influenced by both the temperature and frequency. By fitting the experimental data, the mathematical relations between the fatigue exponent and temperature, and ductility coefficient and temperature, were analyzed. Scanning electron microscopy (SEM) of the cross-sections and fracture surfaces of failed specimens at different temperature and frequency was applied to verify the failure mechanisms. TMS, 2012 Low-cycle fatigue nationallicence temperature effect nationallicence frequency effect nationallicence Coffin-Manson model nationallicence lead-free solder nationallicence Tang Y. School of Electronic and Information Engineering, South China University of Technology, 510641, Guangzhou, China aut Li G.Y. School of Electronic and Information Engineering, South China University of Technology, 510641, Guangzhou, China aut Shi X.Q. Materials and Packaging Technologies Group, Hong Kong Applied Science and Technology Research Institute, Hong Kong Science Park, Hong Kong, Hong Kong aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/1(2013-01-01), 192-200 0361-5235 42:1<192 2013 42 11664 https://doi.org/10.1007/s11664-012-2258-4 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-012-2258-4 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Tang Y. School of Electronic and Information Engineering, South China University of Technology, 510641, Guangzhou, China aut NATIONALLICENCE 700 1- Li G.Y. School of Electronic and Information Engineering, South China University of Technology, 510641, Guangzhou, China aut NATIONALLICENCE 700 1- Shi X.Q. Materials and Packaging Technologies Group, Hong Kong Applied Science and Technology Research Institute, Hong Kong Science Park, Hong Kong, Hong Kong aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/1(2013-01-01), 192-200 0361-5235 42:1<192 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer