naa a22 4500 510800769 CHVBK 20180411083354.0 cr unu---uuuuu 180411e20130601xx s 000 0 eng 10.1007/s11664-013-2486-2 doi (NATIONALLICENCE)springer-10.1007/s11664-013-2486-2 In Situ Characterization of Triboelectrochemical Effects on Topography of Patterned Copper Surfaces [Elektronische Daten] [Sukbae Joo, Hong Liang] The topographic response of patterned copper surfaces to chemical-mechanical polishing (CMP) was investigated using a triboelectrochemical approach. Experimental methods include using a combined system containing a tribometer and a potentiostat. Results showed that more step height reduction and lower average surface roughness were obtained via CMP in acidic than in alkaline slurry. The increased contact area between wafer, pad, and abrasives was associated with the increase in friction. It was found that pH-dependent oxide formation and removal dominate the step height reduction for both acidic and alkaline slurries. The insitu approach pinpointed interactions between mechanical stimulation, chemical reaction, and electrochemical passivation. This research is beneficial to understanding triboelectrochemistry in Cu chemical-mechanical polishing of patterned wafers, an important application in semiconductor manufacturing. TMS, 2013 Copper nationallicence chemical-mechanical polishing nationallicence topographic response nationallicence triboelectrochemical analysis nationallicence patterned wafers nationallicence Joo Sukbae Department of Mechanical Engineering, Texas A&M University, 77843-3123, College Station, TX, USA aut Liang Hong Department of Mechanical Engineering, Texas A&M University, 77843-3123, College Station, TX, USA aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/6(2013-06-01), 979-987 0361-5235 42:6<979 2013 42 11664 https://doi.org/10.1007/s11664-013-2486-2 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2486-2 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Joo Sukbae Department of Mechanical Engineering, Texas A&M University, 77843-3123, College Station, TX, USA aut NATIONALLICENCE 700 1- Liang Hong Department of Mechanical Engineering, Texas A&M University, 77843-3123, College Station, TX, USA aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/6(2013-06-01), 979-987 0361-5235 42:6<979 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer