naa a22 4500 510800777 CHVBK 20180411083354.0 cr unu---uuuuu 180411e20130601xx s 000 0 eng 10.1007/s11664-013-2517-z doi (NATIONALLICENCE)springer-10.1007/s11664-013-2517-z Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation [Elektronische Daten] [S. Lotfian, J.M. Molina-Aldareguia, K.E. Yazzie, J. Llorca, N. Chawla] The reliability of Pb-free solder joints is controlled by their microstructural constituents. Therefore, knowledge of the solder microconstituents' mechanical properties as a function of temperature is required. Sn-Ag-Cu lead-free solder alloy contains three phases: a Sn-rich phase, and the intermetallic compounds (IMCs) Cu6Sn5 and Ag3Sn. Typically, the Sn-rich phase is surrounded by a eutectic mixture of β-Sn, Cu6Sn5, and Ag3Sn. In this paper, we report on the Young's modulus and hardness of the Cu6Sn5 and Cu3Sn IMCs, the β-Sn phase, and the eutectic compound, as measured by nanoindentation at elevated temperatures. For both the β-Sn phase and the eutectic compound, the hardness and Young's modulus exhibited strong temperature dependence. In the case of the intermetallics, this temperature dependence is observed for Cu6Sn5, but the mechanical properties of Cu3Sn are more stable up to 200°C. TMS, 2013 High-temperature nanoindentation nationallicence intermetallics nationallicence lead-free solder nationallicence Sn-Ag-Cu solder nationallicence Lotfian S. IMDEA Materials Institute, C/ Eric Kandel 2, 28906, Getafe, Madrid, Spain aut Molina-Aldareguia J.M. IMDEA Materials Institute, C/ Eric Kandel 2, 28906, Getafe, Madrid, Spain aut Yazzie K.E. Materials Science and Engineering, School for Engineering of Matter, Transport, and Energy, Arizona State University, 85287-6106, Tempe, AZ, USA aut Llorca J. IMDEA Materials Institute, C/ Eric Kandel 2, 28906, Getafe, Madrid, Spain aut Chawla N. Materials Science and Engineering, School for Engineering of Matter, Transport, and Energy, Arizona State University, 85287-6106, Tempe, AZ, USA aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/6(2013-06-01), 1085-1091 0361-5235 42:6<1085 2013 42 11664 https://doi.org/10.1007/s11664-013-2517-z text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2517-z text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Lotfian S. IMDEA Materials Institute, C/ Eric Kandel 2, 28906, Getafe, Madrid, Spain aut NATIONALLICENCE 700 1- Molina-Aldareguia J.M. IMDEA Materials Institute, C/ Eric Kandel 2, 28906, Getafe, Madrid, Spain aut NATIONALLICENCE 700 1- Yazzie K.E. Materials Science and Engineering, School for Engineering of Matter, Transport, and Energy, Arizona State University, 85287-6106, Tempe, AZ, USA aut NATIONALLICENCE 700 1- Llorca J. IMDEA Materials Institute, C/ Eric Kandel 2, 28906, Getafe, Madrid, Spain aut NATIONALLICENCE 700 1- Chawla N. Materials Science and Engineering, School for Engineering of Matter, Transport, and Energy, Arizona State University, 85287-6106, Tempe, AZ, USA aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/6(2013-06-01), 1085-1091 0361-5235 42:6<1085 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer