naa a22 4500 510800793 CHVBK 20180411083354.0 cr unu---uuuuu 180411e20130601xx s 000 0 eng 10.1007/s11664-013-2583-2 doi (NATIONALLICENCE)springer-10.1007/s11664-013-2583-2 Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste [Elektronische Daten] [Tomohiro Yamakawa, Tadashi Takemoto, Masayoshi Shimoda, Hiroshi Nishikawa, Kunio Shiokawa, Nobuto Terada] We investigated a new low-temperature bonding process utilizing Cu nanoparticle paste without addition of sintering promoter. Joint bonding strengths above 30 MPa were achieved even at a low bonding temperature of 250ºC. We attribute the higher bonding strengths of joints fabricated using the vacuum preheating process to the rapid progression of Cu nanoparticle sintering due to the activated nanoparticle surface at lower temperatures. The increase in bonding strength depended on the applied pressure, in addition to the bonding temperature. The formation of a dimple-like morphology was confirmed in the ductile fracture area. This indicated that the joint bonded strongly with the bonding layer, in agreement with the results of bonding tests carried out on strongly bonded joints. The bonding ability of the joints obtained using Cu nanoparticle paste could be improved by controlling the joint fabrication conditions. TMS, 2013 Bonding nationallicence electronic device nationallicence joint process nationallicence nanoparticle nationallicence sintering nationallicence lead-free solder nationallicence Yamakawa Tomohiro Joining and Welding Research Institute, Osaka University, 567-0047, Osaka, Japan aut Takemoto Tadashi Joining and Welding Research Institute, Osaka University, 567-0047, Osaka, Japan aut Shimoda Masayoshi Joining and Welding Research Institute, Osaka University, 567-0047, Osaka, Japan aut Nishikawa Hiroshi Joining and Welding Research Institute, Osaka University, 567-0047, Osaka, Japan aut Shiokawa Kunio Materials Engineering Research Department, Fuji Electric Co., Ltd., 191-8502, Tokyo, Japan aut Terada Nobuto Tukuba Research Laboratory, Harima Chemicals Inc., 300-2635, Tsukuba, Japan aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/6(2013-06-01), 1260-1267 0361-5235 42:6<1260 2013 42 11664 https://doi.org/10.1007/s11664-013-2583-2 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2583-2 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Yamakawa Tomohiro Joining and Welding Research Institute, Osaka University, 567-0047, Osaka, Japan aut NATIONALLICENCE 700 1- Takemoto Tadashi Joining and Welding Research Institute, Osaka University, 567-0047, Osaka, Japan aut NATIONALLICENCE 700 1- Shimoda Masayoshi Joining and Welding Research Institute, Osaka University, 567-0047, Osaka, Japan aut NATIONALLICENCE 700 1- Nishikawa Hiroshi Joining and Welding Research Institute, Osaka University, 567-0047, Osaka, Japan aut NATIONALLICENCE 700 1- Shiokawa Kunio Materials Engineering Research Department, Fuji Electric Co., Ltd., 191-8502, Tokyo, Japan aut NATIONALLICENCE 700 1- Terada Nobuto Tukuba Research Laboratory, Harima Chemicals Inc., 300-2635, Tsukuba, Japan aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/6(2013-06-01), 1260-1267 0361-5235 42:6<1260 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer