naa a22 4500 510800890 CHVBK 20180411083354.0 cr unu---uuuuu 180411e20130601xx s 000 0 eng 10.1007/s11664-013-2515-1 doi (NATIONALLICENCE)springer-10.1007/s11664-013-2515-1 Effect of Applied Load in the Nanoindentationof Gold Ball Bonds [Elektronische Daten] [Muhammad Zulkifli, Azman Jalar, Shahrum Abdullah, Irman Rahman, Norinsan Othman] We have analyzed the effects of nanoindentation at applied loads of 10mN and 20mN on the micromechanical properties of gold (Au) ball bonds with and without cracks. The depth profile and the plastic zone size for each indentation were determined to identify the substrate effect and its relationship with the observed micromechanical properties. The substrate effect occurred for indentations at 20mN applied load, but did not occur near cracks for either 10mN or 20mN loads. Because of the substrate effect and the presence of cracks, the average hardness or yield strength decreased for indentations on Au ball bonds. Therefore, to minimize the substrate effect, an applied load of 10mN is best for characterizing Au ball bonds. TMS, 2013 Nanoindentation nationallicence Au ball bond nationallicence bonding ability nationallicence applied load nationallicence substrate effect nationallicence Zulkifli Muhammad Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, 43600 UKM, Bangi, Selangor, Malaysia aut Jalar Azman Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, 43600 UKM, Bangi, Selangor, Malaysia aut Abdullah Shahrum Department of Mechanical & Materials Engineering, Universiti Kebangsaan Malaysia, 43600 UKM, Bangi, Selangor, Malaysia aut Rahman Irman School of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, 43600 UKM, Bangi, Selangor, Malaysia aut Othman Norinsan School of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, 43600 UKM, Bangi, Selangor, Malaysia aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/6(2013-06-01), 1063-1072 0361-5235 42:6<1063 2013 42 11664 https://doi.org/10.1007/s11664-013-2515-1 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2515-1 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Zulkifli Muhammad Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, 43600 UKM, Bangi, Selangor, Malaysia aut NATIONALLICENCE 700 1- Jalar Azman Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, 43600 UKM, Bangi, Selangor, Malaysia aut NATIONALLICENCE 700 1- Abdullah Shahrum Department of Mechanical & Materials Engineering, Universiti Kebangsaan Malaysia, 43600 UKM, Bangi, Selangor, Malaysia aut NATIONALLICENCE 700 1- Rahman Irman School of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, 43600 UKM, Bangi, Selangor, Malaysia aut NATIONALLICENCE 700 1- Othman Norinsan School of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, 43600 UKM, Bangi, Selangor, Malaysia aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/6(2013-06-01), 1063-1072 0361-5235 42:6<1063 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer