naa a22 4500 510800904 CHVBK 20180411083354.0 cr unu---uuuuu 180411e20130601xx s 000 0 eng 10.1007/s11664-013-2582-3 doi (NATIONALLICENCE)springer-10.1007/s11664-013-2582-3 Reactions of Sn-4.0Ag-0.5Cu on Cu and Electroless Ni Substrate in Premelting Soldering Process [Elektronische Daten] [C. Chung, Y. Chen, T. Yang, C. Kao] Early formation of Cu6Sn5 and (Ni,Cu)6Sn5 during soldering was investigated. Sn4.0Ag0.5Cu solder on Cu and electroless Ni-Au substrate was quenched in ice water after the initial stage of melting, and the solder-substrate interface was analyzed by transmission electron microscopy and energy-dispersive x-ray spectroscopy. At the contacting point, Cu3Sn and Cu6Sn5 were found at the solder-Cu substrate interface, while (Ni,Cu)6Sn5 and Ni2SnP were identified at the solder-electroless Ni interface. The contacting points were confirmed as the sites of heterogeneous nucleation. TEM analysis suggested that the nucleation of both intermetallic compounds can be attributed to diffusion-induced crystallization. Details of the early interfacial reactions are discussed. TMS, 2013 Nanostructures nationallicence lead-free solder nationallicence intermetallic alloys and compounds nationallicence surface and interfaces nationallicence early melting process nationallicence Chung C. Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, 10617, Taipei, Taiwan aut Chen Y. Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, 10617, Taipei, Taiwan aut Yang T. Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, 10617, Taipei, Taiwan aut Kao C. Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, 10617, Taipei, Taiwan aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/6(2013-06-01), 1254-1259 0361-5235 42:6<1254 2013 42 11664 https://doi.org/10.1007/s11664-013-2582-3 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2582-3 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Chung C. Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, 10617, Taipei, Taiwan aut NATIONALLICENCE 700 1- Chen Y. Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, 10617, Taipei, Taiwan aut NATIONALLICENCE 700 1- Yang T. Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, 10617, Taipei, Taiwan aut NATIONALLICENCE 700 1- Kao C. Department of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, 10617, Taipei, Taiwan aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/6(2013-06-01), 1254-1259 0361-5235 42:6<1254 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer