naa a22 4500 510801099 CHVBK 20180411092758.0 cr unu---uuuuu 180411e20130601xx s 000 0 eng 10.1007/s11664-013-2551-x doi (NATIONALLICENCE)springer-10.1007/s11664-013-2551-x Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections. Part 1: Effects of Test Parameters [Elektronische Daten] [Jussi Hokka, Toni. Mattila, Hongbo Xu, Mervi Paulasto-Kröckel] The work presented in part1 of this study focuses on identifying the effects of thermal cycling test parameters on the lifetime of ball grid array (BGA) component boards. Detailed understanding about the effects of the thermal cycling parameters is essential because it provides means to develop more efficient and meaningful methods of reliability assessment for electronic products. The study was carried out with a single package type (BGA with 144 solder balls), printed wiring board (eight-layer build-up FR4 structure), and solder interconnection composition (Sn-3.1Ag-0.5Cu) to ensure that individual test results would be comparable with each other. The effects of (i) temperature difference (ΔT), (ii) lower dwell temperature and lower dwell time, (iii) mean temperature, (iv) dwell time, and (v) ramp rate were evaluated. Based on the characteristic lifetimes, the thermal cycling profiles were categorized into three lifetime groups: (i) highly accelerated conditions, (ii) moderately accelerated conditions, and (iii) mildly/nonaccelerated conditions. Thus, one might be tempted to use the highly accelerated conditions to produce lifetime statistics as quickly as possible. However, to do this one needs to know that the failure mechanisms do not change from one lifetime group to another and that the failure mechanisms correlate with real-use failures. Therefore, in part2 the observed differences in component board lifetimes will be explained by studying the failure mechanisms that take place in the three lifetime groups. TMS, 2013 Reliability nationallicence temperature cycling nationallicence thermal shock nationallicence accelerated lifetime nationallicence test parameters nationallicence Hokka Jussi Department of Electronics, Aalto University, 00076, Aalto, Finland aut Mattila Toni Department of Electronics, Aalto University, 00076, Aalto, Finland aut Xu Hongbo Department of Electronics, Aalto University, 00076, Aalto, Finland aut Paulasto-Kröckel Mervi Department of Electronics, Aalto University, 00076, Aalto, Finland aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/6(2013-06-01), 1171-1183 0361-5235 42:6<1171 2013 42 11664 https://doi.org/10.1007/s11664-013-2551-x text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2551-x text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Hokka Jussi Department of Electronics, Aalto University, 00076, Aalto, Finland aut NATIONALLICENCE 700 1- Mattila Toni Department of Electronics, Aalto University, 00076, Aalto, Finland aut NATIONALLICENCE 700 1- Xu Hongbo Department of Electronics, Aalto University, 00076, Aalto, Finland aut NATIONALLICENCE 700 1- Paulasto-Kröckel Mervi Department of Electronics, Aalto University, 00076, Aalto, Finland aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/6(2013-06-01), 1171-1183 0361-5235 42:6<1171 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence SWISSBIB 510800955 BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer