naa a22 4500 510801196 CHVBK 20180411083356.0 cr unu---uuuuu 180411e20130901xx s 000 0 eng 10.1007/s11664-013-2661-5 doi (NATIONALLICENCE)springer-10.1007/s11664-013-2661-5 Failure Analysis of Board-Level Sn-Ag-Cu Solder Interconnections Under JEDEC Standard Drop Test [Elektronische Daten] [Bo Zhang, Jing Xi, Pin Liu, Han Ding] This work investigates the board-level drop reliability of printed circuit boards (PCBs) assembled using three chip-size packages subjected to Joint Electron Device Engineering Council (JEDEC) standard drop test conditionB. The acceleration and dynamic strain responses at several locations of the board-level package in the time and frequency domain are comprehensively investigated. The results in the time domain suggest that the dynamic response of the board-level package has two phases: forced vibration and free vibration. The maximum response occurs at the first half free vibration cycle. The acceleration response at the center of the PCB is larger than at the edges, whereas the dynamic strain response is just the opposite. The results in the frequency domain show that the first mode is fundamental. In addition, failure analysis is performed using the dye-and-pry test and cross-section test, suggesting that the brittle cracking occurs at the layer between the integrated circuit (IC) pad and the solder, not only through intermetallic compound (IMC) but also along the surface between the IC pad and IMC. TMS, 2013 Dynamic responses nationallicence time domain nationallicence frequency domain nationallicence failure analysis nationallicence intermetallic compound nationallicence Zhang Bo School of Mechanical Engineering, Shanghai Jiao Tong University, 800 Dong Chuan Road, Shanghai, China aut Xi Jing School of Mechanical Engineering, Shanghai Jiao Tong University, 800 Dong Chuan Road, Shanghai, China aut Liu Pin School of Mechanical Engineering, Shanghai Jiao Tong University, 800 Dong Chuan Road, Shanghai, China aut Ding Han School of Mechanical Engineering, Shanghai Jiao Tong University, 800 Dong Chuan Road, Shanghai, China aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/9(2013-09-01), 2848-2855 0361-5235 42:9<2848 2013 42 11664 https://doi.org/10.1007/s11664-013-2661-5 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2661-5 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Zhang Bo School of Mechanical Engineering, Shanghai Jiao Tong University, 800 Dong Chuan Road, Shanghai, China aut NATIONALLICENCE 700 1- Xi Jing School of Mechanical Engineering, Shanghai Jiao Tong University, 800 Dong Chuan Road, Shanghai, China aut NATIONALLICENCE 700 1- Liu Pin School of Mechanical Engineering, Shanghai Jiao Tong University, 800 Dong Chuan Road, Shanghai, China aut NATIONALLICENCE 700 1- Ding Han School of Mechanical Engineering, Shanghai Jiao Tong University, 800 Dong Chuan Road, Shanghai, China aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/9(2013-09-01), 2848-2855 0361-5235 42:9<2848 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer