naa a22 4500 510801242 CHVBK 20180411083356.0 cr unu---uuuuu 180411e20130901xx s 000 0 eng 10.1007/s11664-013-2671-3 doi (NATIONALLICENCE)springer-10.1007/s11664-013-2671-3 Thermoelectric Power Generation Characteristics of a Thin-Film Device Consisting of Electrodeposited n -Bi2Te3 and p -Sb2Te3 Thin-Film Legs [Elektronische Daten] [Min-Young Kim, Tae-Sung Oh] A thermoelectric thin-film device of the cross-plane configuration was fabricated by flip-chip bonding of the top electrodes to 242 pairs of electrodeposited n-type Bi2Te3 and p-type Sb2Te3 thin-film legs on the bottom substrate. The electrodeposited Bi2Te3 and Sb2Te3 films of 20-μm thickness exhibited Seebeck coefficients of −59μV/K and 485μV/K, respectively. The internal resistance of the thin-film device was measured as 3.7kΩ, most of which was attributed to the interfacial resistance of the flip-chip joints. The actual temperature difference ΔT G working across the thin-film legs was estimated to be 10.4 times smaller than the apparent temperature difference ΔT applied across the thin-film device. The thin-film device exhibited an open-circuit voltage of 0.294V and a maximum output power of 5.9μW at an apparent temperature difference ΔT of 22.3K applied across the thin-film device. TMS, 2013 Thermoelectric device nationallicence thin film nationallicence Bi2Te3 nationallicence Sb2Te3 nationallicence electrodeposition nationallicence flip chip nationallicence Kim Min-Young Department of Materials Science and Engineering, Hongik University, 121-791, Seoul, Korea aut Oh Tae-Sung Department of Materials Science and Engineering, Hongik University, 121-791, Seoul, Korea aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/9(2013-09-01), 2752-2757 0361-5235 42:9<2752 2013 42 11664 https://doi.org/10.1007/s11664-013-2671-3 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2671-3 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Kim Min-Young Department of Materials Science and Engineering, Hongik University, 121-791, Seoul, Korea aut NATIONALLICENCE 700 1- Oh Tae-Sung Department of Materials Science and Engineering, Hongik University, 121-791, Seoul, Korea aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/9(2013-09-01), 2752-2757 0361-5235 42:9<2752 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer