naa a22 4500 510803229 CHVBK 20180411083405.0 cr unu---uuuuu 180411e20131201xx s 000 0 eng 10.1007/s11664-013-2817-3 doi (NATIONALLICENCE)springer-10.1007/s11664-013-2817-3 Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction [Elektronische Daten] [L. Yang, Z. Zhang] The effects of Y2O3 nanoparticles doped in Sn-3Ag-0.5Cu solder on the growth behaviors of Cu6Sn5 grains in the soldering reaction with copper were investigated. It is found that the growth rate of Cu6Sn5 grains was markedly decreased due to the addition of Y2O3 nanoparticles. The statistical size distribution results indicated that Cu6Sn5 grains with radius less than the average value account for a high percentage. These results confirm that the nanoparticles can effectively suppress the diffusion behaviors of Cu atoms in the wetting reaction. TMS, 2013 Lead-free solder nationallicence intermetallic compounds nationallicence interfacial reaction nationallicence grain growth nationallicence Yang L. University of Science and Technology of China, 96 JinZhai Road, 230026, Hefei, China aut Zhang Z. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Science, 72 Wenhua Road, 110016, Shenyang, China aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/12(2013-12-01), 3552-3558 0361-5235 42:12<3552 2013 42 11664 https://doi.org/10.1007/s11664-013-2817-3 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2817-3 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Yang L. University of Science and Technology of China, 96 JinZhai Road, 230026, Hefei, China aut NATIONALLICENCE 700 1- Zhang Z. Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Science, 72 Wenhua Road, 110016, Shenyang, China aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/12(2013-12-01), 3552-3558 0361-5235 42:12<3552 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer