naa a22 4500 51080330X CHVBK 20180411083405.0 cr unu---uuuuu 180411e20131201xx s 000 0 eng 10.1007/s11664-013-2763-0 doi (NATIONALLICENCE)springer-10.1007/s11664-013-2763-0 Effect of Ni-Coated Carbon Nanotubes on the Corrosion Behavior of Sn-Ag-Cu Solder [Elektronische Daten] [Y. Han, L. Chen, H. Jing, S. Nai, J. Wei, L.Y. Xu] In this study, the effect of Ni-coated carbon nanotubes (Ni-CNTs) on the corrosion resistance of 95.8Sn-3.5Ag-0.7Cu (SAC) solder at ambient temperature in 3.5wt.% NaCl solution was investigated using the potentiodynamic polarization method. The corrosion products were analyzed by field-emission scanning electron microscopy (S4800), energy-dispersive spectroscopy, and x-ray diffraction. The results showed that addition of Ni-CNTs enhanced the corrosion resistance of the SAC solder and that increasing the content of Ni-CNTs made the effect more evident. The mechanism of the corrosion resistance improvement is the formation of a compact corrosion layer of Ni-CNTs that provides an inert physical barrier to the initiation and development of corrosion. Furthermore, in the corrosion microcell produced by the Ni-CNTs dispersed in the SAC solder, the Ni-CNTs act as a third phase (electrode) which contributes to reducing the galvanic corrosion between Sn anode and Ag3Sn cathode. Hence, the corrosion resistance of the composite solders was improved. TMS, 2013 SAC solder nationallicence Ni-CNTs nationallicence corrosion resistance nationallicence Han Y. School of Materials Science and Engineering, Tianjin University, 300072, Tianjin, China aut Chen L. School of Materials Science and Engineering, Tianjin University, 300072, Tianjin, China aut Jing H. School of Materials Science and Engineering, Tianjin University, 300072, Tianjin, China aut Nai S. Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, 638075, Singapore, Singapore aut Wei J. Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, 638075, Singapore, Singapore aut Xu L.Y. School of Materials Science and Engineering, Tianjin University, 300072, Tianjin, China aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/12(2013-12-01), 3559-3566 0361-5235 42:12<3559 2013 42 11664 https://doi.org/10.1007/s11664-013-2763-0 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2763-0 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Han Y. School of Materials Science and Engineering, Tianjin University, 300072, Tianjin, China aut NATIONALLICENCE 700 1- Chen L. School of Materials Science and Engineering, Tianjin University, 300072, Tianjin, China aut NATIONALLICENCE 700 1- Jing H. School of Materials Science and Engineering, Tianjin University, 300072, Tianjin, China aut NATIONALLICENCE 700 1- Nai S. Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, 638075, Singapore, Singapore aut NATIONALLICENCE 700 1- Wei J. Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, 638075, Singapore, Singapore aut NATIONALLICENCE 700 1- Xu L.Y. School of Materials Science and Engineering, Tianjin University, 300072, Tianjin, China aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/12(2013-12-01), 3559-3566 0361-5235 42:12<3559 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer