naa a22 4500 51080344X CHVBK 20180411083406.0 cr unu---uuuuu 180411e20130301xx s 000 0 eng 10.1007/s11664-012-2385-y doi (NATIONALLICENCE)springer-10.1007/s11664-012-2385-y Room-Temperature Nanoindentation Creep of Thermally Cycled Ultrasonically Bonded Heavy Aluminum Wires [Elektronische Daten] [P.A. Agyakwa, V.M.F. Marques, M.R. Corfield, J.F. Li, L. Yang, C.M. Johnson] Recent findings suggest that creep occurs during thermal cycling of ultrasonically bonded wires, the extent of which is influenced by the nature of the temperature cycle, particularly its peak temperature. In this work, this hypothesis is investigated through a study of the power-law creep behavior of bonded 375-μm aluminum wires that have been thermally cycled. Data from a study of two wire purity levels (99.999% and 99.99%) and two different cycling profiles (−55°C to 125°C and −60°C to 170°C) are presented. Room-temperature creep stress exponents are derived for the wire bonds from constant-load nanoindentation tests and compared with their respective microstructures. TMS, 2013 Ultrasonic wire bonding nationallicence thermal cycling nationallicence nanoindentation nationallicence creep nationallicence power electronics packaging nationallicence Agyakwa P.A. Department of Electrical and Electronic Engineering, The University of Nottingham, University Park, NG7 2RD, Nottingham, UK aut Marques V.M.F. Department of Materials, University of Oxford, Parks Road, OX1 3PH, Oxford, UK aut Corfield M.R. Department of Electrical and Electronic Engineering, The University of Nottingham, University Park, NG7 2RD, Nottingham, UK aut Li J.F. Department of Electrical and Electronic Engineering, The University of Nottingham, University Park, NG7 2RD, Nottingham, UK aut Yang L. Department of Electrical and Electronic Engineering, The University of Nottingham, University Park, NG7 2RD, Nottingham, UK aut Johnson C.M. Department of Electrical and Electronic Engineering, The University of Nottingham, University Park, NG7 2RD, Nottingham, UK aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/3(2013-03-01), 537-544 0361-5235 42:3<537 2013 42 11664 https://doi.org/10.1007/s11664-012-2385-y text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-012-2385-y text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Agyakwa P.A. Department of Electrical and Electronic Engineering, The University of Nottingham, University Park, NG7 2RD, Nottingham, UK aut NATIONALLICENCE 700 1- Marques V.M.F. Department of Materials, University of Oxford, Parks Road, OX1 3PH, Oxford, UK aut NATIONALLICENCE 700 1- Corfield M.R. Department of Electrical and Electronic Engineering, The University of Nottingham, University Park, NG7 2RD, Nottingham, UK aut NATIONALLICENCE 700 1- Li J.F. Department of Electrical and Electronic Engineering, The University of Nottingham, University Park, NG7 2RD, Nottingham, UK aut NATIONALLICENCE 700 1- Yang L. Department of Electrical and Electronic Engineering, The University of Nottingham, University Park, NG7 2RD, Nottingham, UK aut NATIONALLICENCE 700 1- Johnson C.M. Department of Electrical and Electronic Engineering, The University of Nottingham, University Park, NG7 2RD, Nottingham, UK aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/3(2013-03-01), 537-544 0361-5235 42:3<537 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer