naa a22 4500 510803482 CHVBK 20180411083406.0 cr unu---uuuuu 180411e20130301xx s 000 0 eng 10.1007/s11664-012-2383-0 doi (NATIONALLICENCE)springer-10.1007/s11664-012-2383-0 Development and Status of Cu Ball/Wedge Bonding in 2012 [Elektronische Daten] [Martin Schneider-Ramelow, Ute Geißler, Stefan Schmitz, Wolfgang Grübl, Bernhard Schuch] Starting in the 1980s and continuing right into the last decade, a great deal of research has been published on Cu ball/wedge (Cu B/W) wire bonding. Despite this, the technology has not been established in industrial manufacturing to any meaningful extent. Only spikes in the price of Au, improvements in equipment and techniques, and better understanding of the Cu wire-bonding process have seen Cu B/W bonding become more widespread—initially primarily for consumer goods manufacturing. Cu wire bonding is now expected to soon be used for at least 20% of all ball/wedge-bonded components, and its utilization in more sophisticated applications is around the corner. In light of this progress, the present paper comprehensively reviews the existing literature on this topic and discusses wire-bonding materials, equipment, and tools in the ongoing development of Cu B/W bonding technology. Key bonding techniques, such as flame-off, how to prevent damage to the chip (cratering), and bond formation on various common chip and substrate finishes are also described. Furthermore, apart from discussing quality assessment of Cu wire bonds in the initial state, the paper also provides an overview of Cu bonding reliability, in particular regarding Cu balls on Al metalization at high temperatures and in humidity (including under the influence of halide ions). TMS, 2013 Wire bonding nationallicence Cu bonding nationallicence ball/wedge bonding nationallicence quality nationallicence reliability nationallicence Schneider-Ramelow Martin Fraunhofer IZM Berlin, Berlin, Germany aut Geißler Ute TU Berlin, Berlin, Germany aut Schmitz Stefan Fraunhofer IZM Berlin, Berlin, Germany aut Grübl Wolfgang Conti Temic Microelectronics GmbH, Nuremberg, Germany aut Schuch Bernhard Conti Temic Microelectronics GmbH, Nuremberg, Germany aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/3(2013-03-01), 558-595 0361-5235 42:3<558 2013 42 11664 https://doi.org/10.1007/s11664-012-2383-0 text/html Onlinezugriff via DOI 1 review-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-012-2383-0 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Schneider-Ramelow Martin Fraunhofer IZM Berlin, Berlin, Germany aut NATIONALLICENCE 700 1- Geißler Ute TU Berlin, Berlin, Germany aut NATIONALLICENCE 700 1- Schmitz Stefan Fraunhofer IZM Berlin, Berlin, Germany aut NATIONALLICENCE 700 1- Grübl Wolfgang Conti Temic Microelectronics GmbH, Nuremberg, Germany aut NATIONALLICENCE 700 1- Schuch Bernhard Conti Temic Microelectronics GmbH, Nuremberg, Germany aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/3(2013-03-01), 558-595 0361-5235 42:3<558 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer