naa a22 4500 510803601 CHVBK 20180411083406.0 cr unu---uuuuu 180411e20130301xx s 000 0 eng 10.1007/s11664-012-2386-x doi (NATIONALLICENCE)springer-10.1007/s11664-012-2386-x Enhancing the Ductility of Sn-Ag-Cu Lead-Free Solder Joints by Addition of Compliant Intermetallics [Elektronische Daten] [H.X. Xie, N. Chawla] Tin (Sn)-rich lead (Pb)-free solders containing rare-earth (RE) elements have been shown to exhibit desirable attributes of microstructural refinement and enhanced ductility relative to conventional Sn-3.9Ag-0.7Cu lead-free solder, due to the unique mechanical properties of RE-Sn intermetallics. However, the roles of soft intermetallic phase in the enhanced ductility of Pb-free solder still need to be further investigated. In this paper, Ca and Mn were selected as doping elements for Sn-Ag-Cu solder. The mechanical properties of Ca-Sn and Mn-Sn intermetallics as a function of indentation depth were measured by nanoindentation using the continuous stiffness method (CSM). The microstructure and mechanical properties of as-reflowed Ca- and Mn-containing Sn-Ag-Cu solder joints were studied and compared with those of conventional Sn-Ag-Cu and RE-containing solder joints. It is shown that soft intermetallics result in higher ductility in Pb-free solders. TMS, 2012 Lead-free solder nationallicence intermetallic nationallicence Young's modulus nationallicence hardness nationallicence nanoindentation nationallicence calcium nationallicence manganese nationallicence Xie H.X. Materials Science and Engineering, School for Engineering of Matter, Transport and Energy, Arizona State University, 85287-6106, Tempe, AZ, USA aut Chawla N. Materials Science and Engineering, School for Engineering of Matter, Transport and Energy, Arizona State University, 85287-6106, Tempe, AZ, USA aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/3(2013-03-01), 527-536 0361-5235 42:3<527 2013 42 11664 https://doi.org/10.1007/s11664-012-2386-x text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-012-2386-x text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Xie H.X. Materials Science and Engineering, School for Engineering of Matter, Transport and Energy, Arizona State University, 85287-6106, Tempe, AZ, USA aut NATIONALLICENCE 700 1- Chawla N. Materials Science and Engineering, School for Engineering of Matter, Transport and Energy, Arizona State University, 85287-6106, Tempe, AZ, USA aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/3(2013-03-01), 527-536 0361-5235 42:3<527 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer