naa a22 4500 510803628 CHVBK 20180411083406.0 cr unu---uuuuu 180411e20130301xx s 000 0 eng 10.1007/s11664-012-2354-5 doi (NATIONALLICENCE)springer-10.1007/s11664-012-2354-5 Effects of Solvents in the Polyethylene Glycol Serieson the Bonding of Copper Joints Using Ag2O Paste [Elektronische Daten] [Shinya Takata, Tomo Ogura, Eiichi Ide, Toshiaki Morita, Akio Hirose] The effects of reducing solvents on the bonding process using silver oxide paste in a copper joint were investigated. Three solvent types were tested: diethylene glycol (DEG), triethylene glycol (TEG), and polyethylene glycol (PEG). The strength of the joints was assessed by fracturing, which occurred at the interface of the copper oxide layer and the copper substrate in DEG and TEG samples and at the bonded interface in the PEG sample. Analysis of the samples revealed that, in the DEG and TEG samples, the copper substrate was oxidized during the bonding process, which compromised the shear strength of the joints. In contrast, the PEG sample exhibited nonuniform sintering of the silver layer while retaining good shear strength. It was found that the combination of DEG and PEG produced optimum shear strength in the copper joint, as PEG suppressed the growth of copper oxide and DEG promoted the formation of a dense sintered silver layer. The bonding strength achieved was higher than that of the gold-to-gold joint made using standard Pb-5Sn solder. TMS, 2012 Ag nanoparticles nationallicence Ag oxide nationallicence reducing solvent nationallicence shear strength nationallicence Cu joint nationallicence Takata Shinya Division of Materials and Manufacturing Science, Graduate School of Osaka University, 2-1 Yamadaoka, 565-0871, Suita, Japan aut Ogura Tomo Division of Materials and Manufacturing Science, Graduate School of Osaka University, 2-1 Yamadaoka, 565-0871, Suita, Japan aut Ide Eiichi Hitachi Research Laboratory, Hitachi Ltd., 7-1-1 Omika, 319-1292, Hitachi, Japan aut Morita Toshiaki Hitachi Research Laboratory, Hitachi Ltd., 7-1-1 Omika, 319-1292, Hitachi, Japan aut Hirose Akio Division of Materials and Manufacturing Science, Graduate School of Osaka University, 2-1 Yamadaoka, 565-0871, Suita, Japan aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/3(2013-03-01), 507-515 0361-5235 42:3<507 2013 42 11664 https://doi.org/10.1007/s11664-012-2354-5 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-012-2354-5 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Takata Shinya Division of Materials and Manufacturing Science, Graduate School of Osaka University, 2-1 Yamadaoka, 565-0871, Suita, Japan aut NATIONALLICENCE 700 1- Ogura Tomo Division of Materials and Manufacturing Science, Graduate School of Osaka University, 2-1 Yamadaoka, 565-0871, Suita, Japan aut NATIONALLICENCE 700 1- Ide Eiichi Hitachi Research Laboratory, Hitachi Ltd., 7-1-1 Omika, 319-1292, Hitachi, Japan aut NATIONALLICENCE 700 1- Morita Toshiaki Hitachi Research Laboratory, Hitachi Ltd., 7-1-1 Omika, 319-1292, Hitachi, Japan aut NATIONALLICENCE 700 1- Hirose Akio Division of Materials and Manufacturing Science, Graduate School of Osaka University, 2-1 Yamadaoka, 565-0871, Suita, Japan aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/3(2013-03-01), 507-515 0361-5235 42:3<507 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer