naa a22 4500 510803695 CHVBK 20180411083407.0 cr unu---uuuuu 180411e20130301xx s 000 0 eng 10.1007/s11664-012-2343-8 doi (NATIONALLICENCE)springer-10.1007/s11664-012-2343-8 Effect of Ag Content and the Minor Alloying Element Fe on the Mechanical Properties and Microstructural Stability of Sn-Ag-Cu Solder Alloy Under High-Temperature Annealing [Elektronische Daten] [Dhafer Shnawah, Mohd Sabri, Irfan Badruddin, Suhana Said, Tadashi Ariga, Fa Che] This study compares the high-Ag-content Sn-3Ag-0.5Cu with the low- Ag-content Sn-1Ag-0.5Cu solder alloy and the three quaternary solder alloys Sn-1Ag-0.5Cu-0.1Fe, Sn-1Ag-0.5Cu-0.3Fe, and Sn-1Ag-0.5Cu-0.5Fe to understand the beneficial effects of Fe on the microstructural stability, mechanical properties, and thermal behavior of the low-Ag-content Sn-1Ag-0.5Cu solder alloy. The results indicate that the Sn-3Ag-0.5Cu solder alloy possesses small primary β-Sn dendrites and wide interdendritic regions consisting of a large number of fine Ag3Sn intermetallic compound (IMC) particles. However, the Sn-1Ag-0.5Cu solder alloy possesses large primary β-Sn dendrites and narrow interdendritic regions of sparsely distributed Ag3Sn IMC particles. The Fe-bearing SAC105 solder alloys possess large primary β-Sn dendrites and narrow interdendritic regions of sparsely distributed Ag3Sn IMC particles containing a small amount of Fe. Moreover, the addition of Fe leads to the formation of large circular FeSn2 IMC particles located in the interdendritic regions. On the one hand, tensile tests indicate that the elastic modulus, yield strength, and ultimate tensile strength (UTS) increase with increasing Ag content. On the other hand, increasing the Ag content reduces the total elongation. The addition of Fe decreases the elastic modulus, yield strength, and UTS, while the total elongation is still maintainedat the Sn-1Ag-0.5Cu level. The effect of aging on the mechanical behavior was studied. After 720h and 24h of aging at 100°C and 180°C, respectively, the Sn-1Ag-0.5Cu solder alloy experienced a large degradation in its mechanical properties after both of the aging conditions, whereas the mechanical properties of the Sn-3Ag-0.5Cu solder alloy degraded more dramatically after 24h of aging at 180°C. However, the Fe-bearing SAC105 solder alloys exhibited only slight changes in their mechanical properties after both aging procedures. The inclusion of Fe in the Ag3Sn IMC particles suppresses their IMC coarsening, which stabilizes the mechanical properties of the Fe-bearing SAC105 solder alloys after aging. The results from differential scanning calorimetry (DSC) tests indicate that the addition of Fe has a negligible effect on the melting behavior. However, the addition of Fe significantly reduces the solidification onset temperature and consequently increases the degree of undercooling. In addition, fracture surface analysis indicates that the addition of Fe to the Sn-1Ag-0.5Cu alloy does not affect the mode of fracture, and all tested alloys exhibited large ductile dimples on the fracture surface. TMS, 2012 Sn-Ag-Cu alloy nationallicence Ag content nationallicence Fe addition nationallicence microstructure stability nationallicence mechanical properties nationallicence thermal properties nationallicence Shnawah Dhafer Department of Mechanical Engineering, University of Malaya, 50603, Kuala Lumpur, Malaysia aut Sabri Mohd Department of Mechanical Engineering, University of Malaya, 50603, Kuala Lumpur, Malaysia aut Badruddin Irfan Department of Mechanical Engineering, University of Malaya, 50603, Kuala Lumpur, Malaysia aut Said Suhana Department of Electrical Engineering, University of Malaya, 50603, Kuala Lumpur, Malaysia aut Ariga Tadashi Department of Material Science, School of Engineering, Tokai University, 259-1292, Hiratsuka, Japan aut Che Fa Institute of Microelectronics, A_STAR (Agency for Science, Technology and Research), 11 Science Park Road, Singapore Science Park II, 117685, Singapore, Singapore aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/3(2013-03-01), 470-484 0361-5235 42:3<470 2013 42 11664 https://doi.org/10.1007/s11664-012-2343-8 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-012-2343-8 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Shnawah Dhafer Department of Mechanical Engineering, University of Malaya, 50603, Kuala Lumpur, Malaysia aut NATIONALLICENCE 700 1- Sabri Mohd Department of Mechanical Engineering, University of Malaya, 50603, Kuala Lumpur, Malaysia aut NATIONALLICENCE 700 1- Badruddin Irfan Department of Mechanical Engineering, University of Malaya, 50603, Kuala Lumpur, Malaysia aut NATIONALLICENCE 700 1- Said Suhana Department of Electrical Engineering, University of Malaya, 50603, Kuala Lumpur, Malaysia aut NATIONALLICENCE 700 1- Ariga Tadashi Department of Material Science, School of Engineering, Tokai University, 259-1292, Hiratsuka, Japan aut NATIONALLICENCE 700 1- Che Fa Institute of Microelectronics, A_STAR (Agency for Science, Technology and Research), 11 Science Park Road, Singapore Science Park II, 117685, Singapore, Singapore aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/3(2013-03-01), 470-484 0361-5235 42:3<470 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer