naa a22 4500 510803946 CHVBK 20180411083408.0 cr unu---uuuuu 180411e20130401xx s 000 0 eng 10.1007/s11664-012-2391-0 doi (NATIONALLICENCE)springer-10.1007/s11664-012-2391-0 Novel PEN/BaTiO3/MWCNT Multicomponent Nanocomposite Film with High Thermal Stability for Capacitor Applications [Elektronische Daten] [Xu Huang, Zejun Pu, Lifen Tong, Rui Zhao, Xiaobo Liu] In this work, novel nanocomposite films formed from polyarylene ether nitrile (PEN), barium titanate (BaTiO3), and multiwalled carbon nanotubes (MWCNTs) were successfully prepared by the solution casting method combined with continuous ultrasonic dispersion technology. The micromorphology, thermal, mechanical, and dielectric properties of the nanocomposite films are investigated. All of the nanocomposite films exhibited excellent thermal stability and mechanical strength almost the same as pure PEN film. Their initial decomposition temperatures were up to 492°C, and the tensile strength was over 82MPa. Besides, the nanocomposite films had excellent flexibility, as the films could be curled easily into cylinders with several layers. Furthermore, it was found that the film with 1.5wt.% MWCNTs and 20wt.% BaTiO3 had the best comprehensive dielectric properties, with potential for application in organic film capacitors. TMS, 2013 Polyarylene ether nitrile nationallicence barium titanate nationallicence carbon nanotubes nationallicence nanocomposites nationallicence dielectric properties nationallicence thermal properties nationallicence Huang Xu Research Branch of Advanced Functional Materials, Institute of Microelectronic & Solid State Electronic, High-Temperature Resistant Polymers and Composites Key Laboratory of Sichuan Province, University of Electronic Science & Technology of China, 610054, Chengdu, People's Republic of China aut Pu Zejun Research Branch of Advanced Functional Materials, Institute of Microelectronic & Solid State Electronic, High-Temperature Resistant Polymers and Composites Key Laboratory of Sichuan Province, University of Electronic Science & Technology of China, 610054, Chengdu, People's Republic of China aut Tong Lifen Research Branch of Advanced Functional Materials, Institute of Microelectronic & Solid State Electronic, High-Temperature Resistant Polymers and Composites Key Laboratory of Sichuan Province, University of Electronic Science & Technology of China, 610054, Chengdu, People's Republic of China aut Zhao Rui Research Branch of Advanced Functional Materials, Institute of Microelectronic & Solid State Electronic, High-Temperature Resistant Polymers and Composites Key Laboratory of Sichuan Province, University of Electronic Science & Technology of China, 610054, Chengdu, People's Republic of China aut Liu Xiaobo Research Branch of Advanced Functional Materials, Institute of Microelectronic & Solid State Electronic, High-Temperature Resistant Polymers and Composites Key Laboratory of Sichuan Province, University of Electronic Science & Technology of China, 610054, Chengdu, People's Republic of China aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/4(2013-04-01), 726-733 0361-5235 42:4<726 2013 42 11664 https://doi.org/10.1007/s11664-012-2391-0 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-012-2391-0 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Huang Xu Research Branch of Advanced Functional Materials, Institute of Microelectronic & Solid State Electronic, High-Temperature Resistant Polymers and Composites Key Laboratory of Sichuan Province, University of Electronic Science & Technology of China, 610054, Chengdu, People's Republic of China aut NATIONALLICENCE 700 1- Pu Zejun Research Branch of Advanced Functional Materials, Institute of Microelectronic & Solid State Electronic, High-Temperature Resistant Polymers and Composites Key Laboratory of Sichuan Province, University of Electronic Science & Technology of China, 610054, Chengdu, People's Republic of China aut NATIONALLICENCE 700 1- Tong Lifen Research Branch of Advanced Functional Materials, Institute of Microelectronic & Solid State Electronic, High-Temperature Resistant Polymers and Composites Key Laboratory of Sichuan Province, University of Electronic Science & Technology of China, 610054, Chengdu, People's Republic of China aut NATIONALLICENCE 700 1- Zhao Rui Research Branch of Advanced Functional Materials, Institute of Microelectronic & Solid State Electronic, High-Temperature Resistant Polymers and Composites Key Laboratory of Sichuan Province, University of Electronic Science & Technology of China, 610054, Chengdu, People's Republic of China aut NATIONALLICENCE 700 1- Liu Xiaobo Research Branch of Advanced Functional Materials, Institute of Microelectronic & Solid State Electronic, High-Temperature Resistant Polymers and Composites Key Laboratory of Sichuan Province, University of Electronic Science & Technology of China, 610054, Chengdu, People's Republic of China aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/4(2013-04-01), 726-733 0361-5235 42:4<726 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer