naa a22 4500 510803962 CHVBK 20180411083408.0 cr unu---uuuuu 180411e20130401xx s 000 0 eng 10.1007/s11664-012-2452-4 doi (NATIONALLICENCE)springer-10.1007/s11664-012-2452-4 Corrosion Behavior of Pb-Free Sn-1Ag-0.5Cu- X Ni Solder Alloys in 3.5% NaCl Solution [Elektronische Daten] [Udit Mohanty, Kwang-Lung Lin] Potentiodynamic polarization techniques were employed in the present study to investigate the corrosion behavior of Pb-free Sn-1Ag-0.5Cu-XNi solder alloys in 3.5% NaCl solution. Polarization studies indicated that an increase in Ni content from 0.05wt.% to 1wt.% in the solder alloy shifted the corrosion potential (E corr) towards more negative values and increased the linear polarization resistance. Increased addition of Ni to 1wt.% resulted in significant increase in the concentration of both Sn and Ni oxides on the outer surface. Secondary-ion mass spectrometry and Auger depth profile analysis revealed that oxides of tin contributed primarily towards the formation of the passive film on the surface of the solder alloys containing 0.05wt.% and 1wt.% Ni. Scanning electron microscopy (SEM) and energy-dispersive x-ray spectroscopy (EDX) established the formation of a Sn whisker near the passive region of the solder alloy obtained from the polarization curves. The formation of Sn whiskers was due to the buildup of compressive stress generated by the increase in the volume of the oxides of Sn and Ni formed on the outer surface. The presence of Cl− was responsible for the breakdown of the passive film, and significant pitting corrosion in the form of distinct pits was noticed in Sn-1Ag-0.5Cu-0.5Ni solder alloy after the polarization experiment. TMS, 2013 Corrosion nationallicence Pb-free solder alloy nationallicence polarization nationallicence passivity nationallicence pitting nationallicence SIMS nationallicence Mohanty Udit Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, ROC aut Lin Kwang-Lung Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, ROC aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/4(2013-04-01), 628-638 0361-5235 42:4<628 2013 42 11664 https://doi.org/10.1007/s11664-012-2452-4 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-012-2452-4 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Mohanty Udit Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, ROC aut NATIONALLICENCE 700 1- Lin Kwang-Lung Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, ROC aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/4(2013-04-01), 628-638 0361-5235 42:4<628 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer