naa a22 4500 510804071 CHVBK 20180411083408.0 cr unu---uuuuu 180411e20130401xx s 000 0 eng 10.1007/s11664-012-2292-2 doi (NATIONALLICENCE)springer-10.1007/s11664-012-2292-2 Lee Tae-Kyu Component Quality and Technology Group, Cisco Systems, Inc., 95134, San Jose, CA, USA aut Impact of Electrical Current on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects [Elektronische Daten] [Tae-Kyu Lee] The interaction between electrical current and the long-term reliability of fine-pitch ball grid array packages with Sn-3.0Ag-0.5Cu (wt.%) solder ball interconnects is investigated. In this study, 0.4-mm fine-pitch packages with 300-μm-diameter Sn-Ag-Cu solder balls are used. Electrical current was applied under various conditions to two different package substrate surface finishes to compare the effects of chemically unmixed and mixed joint structures: a Cu/SAC305/Cu structure and a NiAu/SAC305/Cu structure, respectively. To study the thermal impact on the thermal fatigue performance and long-term reliability, the samples were thermally cycled from 0°C to 100°C with and without current stressing. Based on Weibull plots, the characteristic lifetime was degraded for the mixed joint structure, but little degradation was observed for the unmixed joint structure. The microstructure evolution was observed during constant current stressing and current stressing during thermal cycling. Accelerated intermetallic precipitation depletion at the package-side interface was observed in NiAu/SAC305/Cu structures due to current stressing, which was identified as the potential reason for the degradation in the thermal cycling performance. TMS, 2012 Pb-free solder nationallicence current stressing nationallicence isothermal aging nationallicence microstructure nationallicence NiAu surface finish nationallicence OSP surface finish nationallicence Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/4(2013-04-01), 599-606 0361-5235 42:4<599 2013 42 11664 https://doi.org/10.1007/s11664-012-2292-2 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-012-2292-2 text/html Onlinezugriff via DOI NATIONALLICENCE 100 1- Lee Tae-Kyu Component Quality and Technology Group, Cisco Systems, Inc., 95134, San Jose, CA, USA aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/4(2013-04-01), 599-606 0361-5235 42:4<599 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer