naa a22 4500 510804144 CHVBK 20180411083409.0 cr unu---uuuuu 180411e20130801xx s 000 0 eng 10.1007/s11664-013-2639-3 doi (NATIONALLICENCE)springer-10.1007/s11664-013-2639-3 Comparison of Sn-Ag-Cu Solder Alloy Intermetallic Compound Growth Under Different Thermal Excursions for Fine-PitchFlip-Chip Assemblies [Elektronische Daten] [Ye Tian, Xi Liu, Justin Chow, Yi Wu, Suresh Sitaraman] The intermetallic compound (IMC) evolution in Cu pad/Sn-Ag-Cu solder interface and Sn-Ag-Cu solder/Ni pad interface was investigated using thermal shock experiments with 100-μm-pitch flip-chip assemblies. The experiments show that low standoff height of solder joints and high thermomechanical stress play a great role in the interfacial IMC microstructure evolution under thermal shock, and strong cross-reaction of pad metallurgies is evident in the intermetallic growth. Furthermore, by comparing the IMC growth during thermal aging and thermal shock, it was found that thermal shock accelerates IMC growth and that kinetic models based on thermal aging experiments underpredict IMC growth in thermal shock experiments. Therefore, new diffusion kinetic parameters were determined for the growth of (Cu,Ni)6Sn5 using thermal shock experiments, and the Cu diffusion coefficient through the IMC layer was calculated to be 0.2028μm2/h under thermal shock. Finite-element models also show that the solder stresses are higher under thermal shock, which could explain why the IMC growth is faster and greater under thermal shock cycling as opposed to thermal aging. TMS, 2013 Lead-free solder nationallicence intermetallic compound nationallicence cross-reaction nationallicence thermal shock nationallicence Tian Ye School of Materials Science and Engineering, Huazhong University of Science and Technology, 430074, Wuhan, China aut Liu Xi The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, 30332, Atlanta, GA, USA aut Chow Justin The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, 30332, Atlanta, GA, USA aut Wu Yi School of Materials Science and Engineering, Huazhong University of Science and Technology, 430074, Wuhan, China aut Sitaraman Suresh The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, 30332, Atlanta, GA, USA aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2724-2731 0361-5235 42:8<2724 2013 42 11664 https://doi.org/10.1007/s11664-013-2639-3 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2639-3 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Tian Ye School of Materials Science and Engineering, Huazhong University of Science and Technology, 430074, Wuhan, China aut NATIONALLICENCE 700 1- Liu Xi The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, 30332, Atlanta, GA, USA aut NATIONALLICENCE 700 1- Chow Justin The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, 30332, Atlanta, GA, USA aut NATIONALLICENCE 700 1- Wu Yi School of Materials Science and Engineering, Huazhong University of Science and Technology, 430074, Wuhan, China aut NATIONALLICENCE 700 1- Sitaraman Suresh The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, 30332, Atlanta, GA, USA aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2724-2731 0361-5235 42:8<2724 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer