naa a22 4500 510804209 CHVBK 20180411083409.0 cr unu---uuuuu 180411e20130801xx s 000 0 eng 10.1007/s11664-013-2614-z doi (NATIONALLICENCE)springer-10.1007/s11664-013-2614-z Kinetics of Dissolution and Isothermal Solidification for Gold-Enriched Solid-Liquid Interdiffusion (SLID) Bonding [Elektronische Daten] [Rogie Rodriguez, Dimeji Ibitayo, Pedro Quintero] This paper presents the development and characterization of a fluxless die-attach soldering process based on gold-enriched solid-liquid interdiffusion (SLID). Eutectic Au-Sn and pure Au were deposited by jet vapor deposition (JVD) onto two substrates, assembled in a sandwiched structure, and processed in a vacuum furnace using different temperatures and times. Microstructural characterization, based on scanning electron microscopy (SEM) and energy dispersive x-ray spectroscopy (EDS) analysis, revealed the formation of sound joints governed by the interdiffusion of the main constituents. Kinetic studies for the dissolution and the isothermal solidification stages were conducted. Differential scanning calorimetry (DSC) revealed a solder joint that is thermally stable up to 498°C, thus demonstrating the effectiveness of using the SLID process for the production of joints which require a lower processing temperature compared with their remelting point. Based on these findings, the recommended final bonding parameters are processing temperature and time of 340°C (310°C<T P<340°C) and 5min, respectively. TMS (outside the USA), 2013 SLID nationallicence isothermal solidification nationallicence lead-free solder nationallicence fluxless nationallicence high temperature nationallicence eutectic gold-tin nationallicence Rodriguez Rogie Department of Mechanical Engineering, University of Puerto Rico, Mayagüez, Puerto Rico aut Ibitayo Dimeji US Army Research Laboratory, Adelphi, MD, USA aut Quintero Pedro Department of Mechanical Engineering, University of Puerto Rico, Mayagüez, Puerto Rico aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2677-2685 0361-5235 42:8<2677 2013 42 11664 https://doi.org/10.1007/s11664-013-2614-z text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2614-z text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Rodriguez Rogie Department of Mechanical Engineering, University of Puerto Rico, Mayagüez, Puerto Rico aut NATIONALLICENCE 700 1- Ibitayo Dimeji US Army Research Laboratory, Adelphi, MD, USA aut NATIONALLICENCE 700 1- Quintero Pedro Department of Mechanical Engineering, University of Puerto Rico, Mayagüez, Puerto Rico aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2677-2685 0361-5235 42:8<2677 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer