naa a22 4500 51080425X CHVBK 20180411083409.0 cr unu---uuuuu 180411e20130801xx s 000 0 eng 10.1007/s11664-013-2615-y doi (NATIONALLICENCE)springer-10.1007/s11664-013-2615-y A Study on the Physical Properties and Interfacial Reactions with Cu Substrate of Rapidly Solidified Sn-3.5Ag Lead-Free Solder [Elektronische Daten] [Hai-Tao Ma, Jie Wang, Lin Qu, Ning Zhao, A. Kunwar] A rapidly solidified Sn-3.5Ag eutectic alloy produced by the melt-spinning technique was used as a sample in this research to investigate the microstructure, thermal properties, solder wettability, and inhibitory effect of Ag3Sn on Cu6Sn5 intermetallic compound (IMC). In addition, an as-cast Sn-3.5Ag solder was prepared as a reference. Rapidly solidified and as-cast Sn-3.5Ag alloys of the same size were soldered at 250°C for 1s to observe their instant melting characteristics and for 3s with different cooling methods to study the inhibitory effect of Ag3Sn on Cu6Sn5 IMC. Experimental techniques such as scanning electron microscopy, differential scanning calorimetry, and energy-dispersive spectrometry were used to observe and analyze the results of the study. It was found that rapidly solidified Sn-3.5Ag solder has more uniform microstructure, better wettability, and higher melting rate as compared with the as-cast material; Ag3Sn nanoparticles that formed in the rapidly solidified Sn-3.5Ag solder inhibited the growth of Cu6Sn5 IMC during aging significantly much strongly than in the as-cast material because their number in the rapidly solidified Sn-3.5Ag solder was greater than in the as-cast material with the same soldering process before aging. Among the various alternative lead-free solders, this study focused on comparison between rapidly solidified and as-cast solder alloys, with the former being observed to have better properties. TMS, 2013 Lead-free solder nationallicence rapidly solidified solder nationallicence wettability nationallicence IMCs nationallicence Ag3Sn nationallicence Ma Hai-Tao School of Materials Science and Engineering, Dalian University of Technology, 116024, Dalian, China aut Wang Jie School of Materials Science and Engineering, Dalian University of Technology, 116024, Dalian, China aut Qu Lin School of Materials Science and Engineering, Dalian University of Technology, 116024, Dalian, China aut Zhao Ning School of Materials Science and Engineering, Dalian University of Technology, 116024, Dalian, China aut Kunwar A. School of Materials Science and Engineering, Dalian University of Technology, 116024, Dalian, China aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2686-2695 0361-5235 42:8<2686 2013 42 11664 https://doi.org/10.1007/s11664-013-2615-y text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2615-y text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Ma Hai-Tao School of Materials Science and Engineering, Dalian University of Technology, 116024, Dalian, China aut NATIONALLICENCE 700 1- Wang Jie School of Materials Science and Engineering, Dalian University of Technology, 116024, Dalian, China aut NATIONALLICENCE 700 1- Qu Lin School of Materials Science and Engineering, Dalian University of Technology, 116024, Dalian, China aut NATIONALLICENCE 700 1- Zhao Ning School of Materials Science and Engineering, Dalian University of Technology, 116024, Dalian, China aut NATIONALLICENCE 700 1- Kunwar A. School of Materials Science and Engineering, Dalian University of Technology, 116024, Dalian, China aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2686-2695 0361-5235 42:8<2686 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer