naa a22 4500 510804284 CHVBK 20180411083409.0 cr unu---uuuuu 180411e20130801xx s 000 0 eng 10.1007/s11664-013-2575-2 doi (NATIONALLICENCE)springer-10.1007/s11664-013-2575-2 Modeling the Rate-Dependent Durability of Reduced-Ag SAC Interconnects for Area Array Packages Under Torsion Loads [Elektronische Daten] [Vikram Srinivas, Sandeep Menon, Michael Osterman, Michael Pecht] Solder durability models frequently focus on the applied strain range; however, the rate of applied loading, or strain rate, is also important. In this study, an approach to incorporate strain rate dependency into durability estimation for solder interconnects is examined. Failure data were collected for SAC105 solder ball grid arrays assembled with SAC305 solder that were subjected to displacement-controlled torsion loads. Strain-rate-dependent (Johnson-Cook model) and strain-rate-independent elastic-plastic properties were used to model the solders in finite-element simulation. Test data were then used to extract damage model constants for the reduced-Ag SAC solder. A generalized Coffin-Manson damage model was used to estimate the durability. The mechanical fatigue durability curve for reduced-silver SAC solder was generated and compared with durability curves for SAC305 and Sn-Pb from the literature. TMS, 2013 Ball grid array packages nationallicence Johnson-Cook model nationallicence interconnect reliability nationallicence lead-free solders nationallicence finite-element analysis nationallicence Weibull analysis nationallicence Srinivas Vikram Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MA, USA aut Menon Sandeep Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MA, USA aut Osterman Michael Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MA, USA aut Pecht Michael Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MA, USA aut Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2606-2614 0361-5235 42:8<2606 2013 42 11664 https://doi.org/10.1007/s11664-013-2575-2 text/html Onlinezugriff via DOI 1 research-article jats NATIONALLICENCE 856 40 https://doi.org/10.1007/s11664-013-2575-2 text/html Onlinezugriff via DOI NATIONALLICENCE 700 1- Srinivas Vikram Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MA, USA aut NATIONALLICENCE 700 1- Menon Sandeep Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MA, USA aut NATIONALLICENCE 700 1- Osterman Michael Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MA, USA aut NATIONALLICENCE 700 1- Pecht Michael Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MA, USA aut NATIONALLICENCE 773 0- Journal of Electronic Materials Springer US; http://www.springer-ny.com 42/8(2013-08-01), 2606-2614 0361-5235 42:8<2606 2013 42 11664 Metadata rights reserved Springer special CC-BY-NC licence nationallicence BK010053 XK010053 XK010000 NATIONALLICENCE NATIONALLICENCE NL-springer